Moldex3D IC Packaging helps chip designers to fully analyze the chip encapsulation process from filling, curing, cooling, to advanced manufacturing demands, such as wire sweep, die shift, filler concentration, underfill encapsulation, post-molding curing, stress distribution, or structural evaluation. Significant molding problems can be predicted and solved upfront, which helps engineers enhance chip quality and prevent potential defects more efficiently. The accurate simulation also helps design optimization and well cost management.
Related Products
Moldex3D
Electronics Potting
iSLM
Moldiverse
Composite Molding
You may also like
HTS伺服节能系列注塑机
SUMITOMO All-electric Small-sized Injection Molding Machine for Lens