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Description
During IC packaging process, the curing reaction of the packaging material causes considerable shrinkage and warpage of the chip package body, which is one of the main reasons why the quality of the package body would be difficult to control.
PVTC is buid to solve this issue.
Features:
1. Measuring the slight volume(um) under different temperature, pressure
and degree of cure
2. Establishing the relationship between the specific volume and degree of
cure of material based on curing kinetics.(With DSC)
3. With the support of CAE software, it is possible to predict the compreh-
ensive dimensional changes at various stages(time variation) and
different locations(spatial variation)
Patents for PVTC-A1:
Taiwan: Invention No. I640770
USA: US 10,641,692 B2
European Economic Community: EP3410095
PVTC is buid to solve this issue.
Features:
1. Measuring the slight volume(um) under different temperature, pressure
and degree of cure
2. Establishing the relationship between the specific volume and degree of
cure of material based on curing kinetics.(With DSC)
3. With the support of CAE software, it is possible to predict the compreh-
ensive dimensional changes at various stages(time variation) and
different locations(spatial variation)
Patents for PVTC-A1:
Taiwan: Invention No. I640770
USA: US 10,641,692 B2
European Economic Community: EP3410095
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