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PVTC Analyzer
Model:
PVTC-A1
Category: 13155
Exhibitor:
U-CAN DYNATEX INC.
Booth No: A530
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Description
During IC packaging process, the curing reaction of the packaging material causes considerable shrinkage and warpage of the chip package body, which is one of the main reasons why the quality of the package body would be difficult to control. PVTC is buid to solve this issue.
Features: 1. Measuring the slight volume(um) under different temperature, pressure and degree of cure 2. Establishing the relationship between the specific volume and degree of cure of material based on curing kinetics.(With DSC) 3. With the support of CAE software, it is possible to predict the compreh- ensive dimensional changes at various stages(time variation) and different locations(spatial variation)
Patents for PVTC-A1: Taiwan: Invention No. I640770 USA: US 10,641,692 B2 European Economic Community: EP3410095
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